DIGITAL-JU-CHIPS-2025-IA-LEAI

Successful proposals are expected to deliver AI chip prototypes reaching TRL 6-7, integrating cutting-edge technologies such as non-volatile memories, neuromorphic computing, 3D heterogeneous integration, and photonic connectivity. These prototypes should be tested under real-world conditions and show potential for industrial scaling. The project emphasizes leveraging advanced capabilities of state-of-the-art infrastructures within the Union, including the Testing and Experimentation Facility (TEF) for Edge AI hardware and Pilot Lines of the Chips for Europe Initiative. The prototypes must demonstrate robust AI capabilities, ultra-low power consumption, and contribute to Europe’s digital transformation and sustainability goals.