Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration

This grant aims to open new opportunities for European-based semiconductor packaging companies and their supply chain by leveraging the services of Research and Technology Organizations (RTOs) and all Chips JU pilot lines. Projects are expected to accelerate the transfer of technologies from pilot lines to industrial deployment, expand the advanced packaging ecosystem in Europe, and boost competitiveness by providing a fast path to industrialization of European semiconductor technology. Through the involvement of actors across the value chain—including materials, substrate, equipment, and test providers, as well as packaging companies and their European customers—projects should foster a strong European innovation and technology transfer ecosystem, building new and resilient supply chains in Europe.